Thursday, July 4, 2013
EEStor Layer 200X Competitor
There is two take home messages. The first is that technical success appears to be plausible and potentially spectacular. The second message is that the development work is continuingly slow as I long ago anticipated. Enthusiasm on development schedules belong to stock brokers only. Otherwise your partner is Murphy even when it is a slam dunk.
They may have shippable product in another two years. Far more important is that the production of a shippable product is becoming increasingly likely. They have viable working layers which is a long hard advance from a bin of powder.
200X the competition is a loud shot across anyone’s bow.
EEStor Provides Additional Test Data Following June 5, 2013 Testing And Update On Current Status
June 26, 2013
CEDAR PARK, Texas, June 26, 2013 /PRNewswire/ -- On June 5, 2013 EEStor, Inc. had Criteria Labs certify certain aspects of a current layer of its electrical energy storage unit (EESU) that had been produced on April 29, 2013 using new materials that provided both high capacitance and high resistance simultaneously. The capacitance and resistance of this new layer material are expected to be increased using EEStor, Inc. proven proprietary processing equipment and processes.
The following data from new layer material was certified by Criteria Labs on June 5, 2013:
Average capacitance of the four layers = 0.22 micro farads
Average Resistance of the four layers = 10.7 mega ohms
Subsequently, on June 26, 2013 EEStor, Inc. had the area and thickness of the new material layer certified by TesCom at EEStor, Inc. using TesCom calibrated EEStor, Inc. equipment. TesCom was called in to certify these results due to scheduling issues with Criteria Labs. Subsequent testing will be conducted by Criteria Labs. The equipment used to measure the area and thickness was certified by TesCom, a calibration company which was selected by Criteria for the certification of the equipment used in their June 5, 2013 certification process.
The following data from new layer material was certified by TesCom:
Average thickness of the four layers = 25.1 microns
The area of each of the four layers = 0.403 centimeters squared
The average volume of the four layers = 0.00101 centimeters cubed
Using the certified capacitance, area, thickness, and volume the following relative permittivity was calculated:
The average relative permittivity of the four layers = 15,476
EEStor believes that relative permittivity of 15,476 and an insulation resistance of 10.7 mega ohms of this initial new material test layer represents a major breakthrough in EEStor, Inc. new dielectric materials. By comparison, a 0.22 micro farad 100 V capacitor manufactured by EPCOS has a volume of 0.216 cubic centimeters or 214 times bigger than EEStor's equivalent capacitance. Capacitance is directly proportional to energy storage and this high capacitance volume also indicates the ability of EEStor, Inc. to potentially exceed its energy storage operating targets.
EEStor has now successfully enhanced the new dielectric layer of its EESU and initial internal results indicate the following:
-- Capacitance vs. voltage has been increased
-- Layer resistance has been increased
-- Capacitance has been increased
-- Constituent tuning has been improved which allows the potential for
continued success in product development
As soon as EEStor reaches its optimal constituent tuning of its latest layers it will complete the testing and certification with Criteria Labs. The tests and certification of these samples will include:
-- energy density
-- dissipation factor
-- capacitor area
-- total layer thickness
-- leakage current at multiple voltages including voltages over 1000V
-- dielectric layer thickness
This press release contains "forward-looking statements," including statements related to expected increases in capacitance and resistance of the new layer, permittivity representing a major breakthrough, EEStor potentially exceeding its energy storage operating targets, and potential for continued success in product development. These statements are subject to a number of risks and uncertainties, including the risk of development or production delays, the risk that the technology or devices may not perform as expected, component or raw materials delays or shortages, the ability to effectively manage operating expenses and manufacturing operations and the ability to maintain or raise sufficient capital to fund current development and production goals. EEStor's actual results may differ materially from the expected results in this release. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date such statements are made. EEStor does not undertake any obligation to publicly update any forward-looking statements to reflect events, circumstances or new information after this press release, or to reflect the occurrence of unanticipated events.
SOURCE EEStor, Inc.
/CONTACT: Dick Weir, President & CEO, email@example.com